Shanghai, May 25, 2026 - At the 2026 International Symposium on Circuits and Systems held today in Shanghai, Huawei's Director and Semiconductor Business President, He Tingbo, officially introduced the "Tao (τ) Law" during his keynote speech.
This is the first time China has put forward its own guiding principle for the future development of the global semiconductor industry.
According to He Tingbo, Huawei has already designed and mass-produced 381 chips over the past six years by following this new approach. This fall, the company plans to release a new Kirin smartphone chip that fully utilizes "logic folding" technology, promising a major leap in performance.
So what is the Tao Law? In simple terms, it shifts the focus from traditional "geometric scaling" (making transistors smaller and smaller) to "time scaling." The goal is to systematically reduce the time constant - referred to as Tao τ - by compressing signal propagation delays through innovations like logic folding, while also continuing to increase transistor density.
With Moore's Law running into both physical and economic walls, the industry has been searching for a new path. Huawei believes the Tao Law offers a viable way forward to keep improving chip performance sustainably.
The approach involves coordinated optimization across devices, circuits, chips, and entire systems. Huawei expects that by 2031, chips developed under the Tao Law will reach transistor densities on par with today's 1.4nm process technology.
He Tingbo closed by emphasizing international cooperation, saying: "The future belongs to open collaboration. We look forward to working closely with scientists, engineers, and industry partners around the world to advance the semiconductor and electronics industries together."
